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MHC(孔金属化)
Sub-SegmentProcess(制程)Product(产品)
HDI/SLPE'less CuCP4000
L/S,ProcessH/VCPL/S 30/30 MSAP
HDI High End/ELICH'Eless CuCP4000

CP6700(ionic Pd)
HDI ConventionalH'Eless CuCP3350-1/CP6300(ionic Pd)
Traditionalfor PC, ConsumerH'Eless Cu
Cost effectiveV'Eless CuCP880/LC9100
Advanced for Auto/ TelecomH'Eless CuCP4000
V'Eless CuCP253/CP880/CP3000
DesmearHP3303/4216,
Build up layerSAP E’less Cu Ionic (major)Gen 1: Ionic Pd SAP, CP ADV8500 ABF GX/GL, Sekisui NX, Mid Ra
SAP DesmearGen 1 SAP Desmear, CP7800 ABF GX3/GX13. Sekisui NX, Mid Ra
Core layerH' Eless CuCP4000
DS/ML/RFDirect PlatingCP680/CP4000, ELF(EF-65)
Mark: Eless Cu除CP6300/CP6700离子钯外,其余为胶体钯



EP Cu (电镀铜)
Sub-SegmentProcess(制程)Product(产品)
HDI/ELICPanel viafill+TH PlatingEVF,EVF15/HC650,LVF,EVFⅢ(Cu 18um; 80% TP of TH Distribution +/-1.5um)
SLPpattern viafillLVF-Ⅳ
Telecom/Server (AR﹥16)Conformal Plating (Pulse)"CuPulse*/PPR* PPRII” (100% TP of TH for AR~17 board)"
Telecom/Server (AR10-16)Conformal Plating (DC)EP1000”/EP1400”/EP1500* ,EP1600* (>80% TP of TH at 8-12ASF)
Automotive(AR﹤10)Conformal Plating (DC)HS200/HV606/ST901/HV101/ST920, HV609S(AR8:1,80%TP at 30ASF)
FC/SiP/ETS/RDLpattern viafillTHF-100/VHF, LVH-Ⅳ,SFP
Consumer, SmartphonePanel viafill"HS200/HV606 CLX/HGX/HV303, HSV-100 (Ultra thin Cu 15um; 5ASD)"


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